Ho Tšepahala ho Phahameng.
1.Moqapi o matla bakeng sa ho hanyetsa ho sisinyeha le ho mamella mocheso o feteletseng (-25 ° C ho + 85 ° C).
Likhokahano tsa 2.Gold-plated li netefatsa khanyetso e tlaase le conductivity e tsitsitseng.
.Compact & Lightweight.
1. Moralo oa 1.5mm pitch wafer o boloka sebaka, o loketse ho kenya lisebelisoa tse thata ho li-module tsa lebone la koloi.
2.Mohaho o bobebe (boima: ≤0.5g ka ho kopana).
Kopanyo e Bonolo.
1.Moqapi oa plug-and-play o nang le li-terminals tse mebala-bala bakeng sa ho kopanya kapele.
2.E lumellana le mekhoa e tloaelehileng ea SMT/LD.
Setifikeiti.
1.IATF 16949 (Taolo ea Boleng bakeng sa Indasteri ea Likoloi)
2.ISO 9001/14001
.Paramethara. | .Boleng. |
.Pitch. | 1.5mm (±0.1mm mamello) |
.Nomoro ea Mabitso. | 2–10 maemo (a ka lokisoa) |
.Tekanyo ea Voltage. | 100V DC / 12V AC |
.Boemo ba Hona Joale. | 2A ka lebitso |
.Mocheso oa ho sebetsa | -40°C ho ea ho +125°C |
.Mofuta oa ho Felisoa. | IDC (Insulation Displacement Connector) |
.Tšehetso ea Wire Gauge. | 2.0A(24 AWG) 1.5A (26 AWG) 1.0A(28 AWG) |
Stand Packing Bongata | 800/reel |
.Boima ba 'mele. | 0.3–0.8g sehokelo ka seng |
.Setifikeiti. | IATF 16949, ISO9001 14001 |
● Litsamaiso tsa Mabone a Likoloi:Mabone a hlooho, Mabone a Moholi, Mabone a Mohatla, Li-Module tsa Mabone a ka Hare.
● Basebelisi ba Lebeletsoeng:Li-OEM tsa Likoloi, Bafani ba Tier-1, Baetsi ba Likarolo tsa Aftermarket.
●Global Compliance: E kopana le litekanyetso tse thata tsa likoloi (ISO, IATF, ).
●Chelete e sebetsang: Litheko tsa tlholisano tsa FOB/EXW tse nang le MOQ e tlase
●Phano e potlakileng: Tšehetsa thomello ea DDP libakeng tsa lefatše ka bophara nakong ea matsatsi a 15–30.
●Ka mor'a-Thekiso Tšehetso: 24/7 thuso ea botekgeniki
1.Ho kenya kopano ea lebone la koloi.
Li-label tsa 2.Certification (UL, IATF, joalo-joalo).